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HIBRID
INTEGRATED MODULES
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At
the "Metalokeramika" Company a flexible technological
production line has been created for the manufacture of miscellaneous
structural designs of custom-made to order thick layer hybrid
ICs:
1. Resistive and transistor sets
characterized by very narrow tolerances of electrical resistance
(0.1%; 0.5%; 1 %; 2%; 5%), very good thermal coefficient, of electrical
resistance, retention of parameters up to 10.000 h, up to 20 years
life-span, resistance to corrosion in salt mist media, frost,
moulds, high or low pressures. The operational temperature range
is between - 60° С and + 85°C.
2. Digital and analogue circuits for surface mounting
3. Thick layer hybrid circuits with chip and wire bonding
- components for low frequency and UHF design and possibility
for bonding microband connections in UHF packages up to 15 deep
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4.
High power hybrid thick layer circuits in sealed and plastic packages
with possibility for fixing to the heat sink components with high coefficient
of power dissipation.
5. Hybrid ICs for mixed assembly of conventional and surface
mounted (SMD) components
6. Contemporary circuits for operation under elevated pressure
with wire bonding, with droplet protection and verification. |
The
basic stages of the technological process are achieved by semi-automatic
work sites in an effort to create better flexibility in the implementation
of the production of small, but flexible circuit designs. The equipment
offers the following possibilities according to the different processes:
- design
- optimization of the electrical diagram according to basic elements
using the available software packages through matching the parameters
of the separate elements;
- development of the technology using a computer aided design system
B/CAD of the "BINDER" Company, Federal Republic Germany. |
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time required for the preparation of the topological layers of a circuit
with 10 components for assembly, 10 resistors and size 1" х 1"
is up to 2 working days. |
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preparation of photo tools according to the layout - performed with
the aid of a photo-plotter "MIVA" - FRG which operates
all known and used up to now formats ( Hewlett Packard, Glaser,
IBM, etc.) or with inherent assigned apertures and pitches. Due
to the unique system for creating the image by a TV picture tube
instead of a scanning beam, the speed for the preparation of a 2"
х 2" photo tool is up to 10 minutes. The positioning accuracy
is ± 1 цт and resolving power - 10 цт.
- photographic processing of the photo tools - performed with
a combined photographic unit "RAPI-LINE" - FRG with strict
reproducibility of the image parameters.
- preparation of the screens, |
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screen printing of the circuits - carried out by semi-automatic machines
"Cw-Prise" - USA with a TV camera for joint adjustment of the
images and very accurate individual adjustment of speed, off set and pressure
of the squeegee, leveling the height of the screen, vacuum positioning
of the substrate, etc. |
-drying
of the pastes-a "BINDER"
- FRG dryer is used, with good protective convection of air
at an accuracy of ± 1° С temperature control.
- laser trimming of resistors - carried out by a MLS trimmer
- FRG. It is possible to check all resistors simultaneously in order
to achieve functional trimming of already mounted circuits.
The measurement range is 0.1 ohm -100 Mohm, voltage measuring range
is up to 100 V. The accuracy of beam positioning is 2,5 цт, reproducibility
of positioning is less than 10 цт. |
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scribing of the circuits - carried out with a disk scriber "DISCO
DAD"
- Japan and manual scriber with notching "ATV" - FRG.
The smoothness of the scribed edge offers a possibility to manufacture
circuits for GHF instruments and devices.
-mounting of SMD -surface mounted devices - is carried out with
a semi-automatic machine Funk und Meyer - 204 - FRG. Number of types of
components - 64. It is possible to work with cassettes, sticks, magazines,
trays and loose bulk components. |
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bonding - wire bonders are used
- "Mech-cl" - FRG and "Hybond"
- USA with possibilities for bonding with aluminium and gold
wire 12
- 100 urn diameter and gold strip for UHF devices.
- protective encapsulation of the bonded devices - droplet
protection and vitrification by manipulators and doser unit "ATV"
- FRG.
- alloying and reflow of the surface mounted devices in a
conveyor furnace for alloying "Ersa" - FRG with very strictly
controlled temperature profile.
-mounting of leads-carried out with manually operated units
"Komatel" for SIL and OIL terminal leads.
- tin plating of the leads - carried out with a wave soldering
unit "Kon-tasold" |
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functional evaluation of the circuits
- carried out with individual testers under maximum simulation
of the operating conditions of the circuits.
- reliability tests - performed with a test bench for impacts
and vibrations, a thermal cycling chamber Weiss, chamber for humid
heat "ILKA" - GDR, a salt mist chamber, etc. |
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In
case a skilfull balancing between the possibilities of the parameters
of the equipment is achieved, the production line has a capacity
to manufacture 1.5-2 million ICs with average complexity annually.
The time required for implementing a circuit, starting from the
reception of the electrical diagram up to the implementation in
the production is between 20 and 45 days, depending on the functional
complexity of the IC.
Application: in the industrial electronics, automotive electronics,
management and control techniques, space technology, sensor-transducer
techniques, medical equipment, telecommunication, etc.
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